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Atotech to present its market leading chemistry and equipment solutions at the KPCA 2017

12 April 2017
BERLIN, 12. April, 2017: Atotech, one of the leading companies for specialty plating chemicals, equipment and services will be showcasing its latest product developments at KPCA show, booth 201, KINTEX Exhibition Center, from April 25 to 27, 2017.

Atotech will also present its new microetching process CupraEtch® FH at the adjacent Electronic Circuits World Convention and participate in the KPCA NPI seminar with two presentations, highlighting its new product series InPro® for vertical conveyorized plating lines (VCP) and its latest capabilities for horizontal plating solutions: Uniplate® P/LB/Cu6 for modified Semi-Additive Processes (mSAP), and Uniplate® P/LB for advanced modified Semi-Additive Processes (amSAP).

CupraEtch® FH – A new ferric-sulfate based microetching process
WonJin Cho, Product Development Manager for Surface Treatment Technology at Atotech (China) Chemicals Ltd., will present a new and advanced soldermask and photoresist pretreatment system at the Electronic Circuits World Convention at the KPCA in room 306 on April 25, 2017, from 1 to 1:30 pm. The presentation will discuss why this new ferric-sulfate based microetching process is technically and commercially superior to existing POR pretreatment chemistries. Additionally, Cho will explain how CupraEtch® FH helps reduce waste water volumes and meets low etch depth requirements.

InPro® series – New vertical electrolytic copper plating process family
SukYoung Kim, Sales and Product Marketing Manager at Atotech Korea Ltd., will present Atotech’s new copper plating solutions for vertical plating lines for the next generation HDI and advanced packaging at the NPI semionar in the onsite seminar room, exhibition hall 7, on April 25, 2017, from 3 to 4 pm. The main focus will be on InPro® THF, a new process for through hole filling, and InPro® SAP2 for pattern BMV filling, both for advanced package substrate manufacturing. Kim will also show two solutions for different copper pillar manufacturing technologies (InPro® PI and InPro® CPF). For next generation HDI PCBs, he will introduce Atotech’s latest performance with InPro® MVF, a new process for panel and pattern BMV filling. Last but not least, Kim will give an outlook on our latest development for fan-out panel level packaging, MultiPlate®.

Uniplate® P/LB/Cu6 for mSAP and Uniplate® P/LB for amSAP
JinHee Kim, System Sales at Atotech Korea Ltd., will discuss the benefits of Atotech’s horizontal equipment lines and present Uniplate® P/LB/Cu6, the solution of choice for many mSAP HDI and rigid-flex PCB manufacturer, as well as Uniplate® P/LB, today’s leading horizontal desmear and electroless copper system for amSAP used for HDI and advanced package substrate manufacturing. Both subjects will be presented at the NPI seminar in the onsite seminar room, exhibition hall 7, on April 25, 2017, from 2 to 3 pm.

Atotech invites visitors to KPCA Show 2017 to join the seminar talks and stop by its trade show booth, number 201, located directly across from the Automotive Industry Pavillion, to learn more about its market-leading products and roadmap.


Contact
Yvonne Fuetterer
Erasmusstr. 20
10553 Berlin, Germany
+49 30-349 85-220
yvonne.fuetterer@atotech.com
www.atotech.com                      

About Atotech
Atotech is one of the world’s leading manufacturers of specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor industries, as well as for the decorative and functional surface finishing industries. Atotech has annual sales of USD1.1 billion. The company is fully committed to sustainability – we develop technologies to minimize waste and to reduce environmental impact. Atotech has its headquarters in Berlin, Germany, and employs more than 4,000 people in over 40 countries.

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